MOS random access memory device with an internal voltage-down converting transistor
AssigneeKabushiki Kaisha Toshiba
InventorsKenji Tsuchida, Takashi Ohsawa
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AssigneeKabushiki Kaisha Toshiba
InventorsKenji Tsuchida, Takashi Ohsawa
Estimating the term…
A MOS dynamic random access memory device has a memory cell array section formed on a semiconductor substrate, including memory cells each having a data storage capacitor and a transfer-gate transistor. Parallel bit lines are associated with the memory cell array section. Parallel word lines extend transverse to the bit lines, including a word line connected to the transfer-gate transistor. A booster circuit is arranged to provide a potentially raised voltage which is higher than a power supply voltage. A sense amplifier circuit is connected with a corresponding bit line pair of the word lines. A word-line driver circuit has an input connected to the booster circuit and an output connected to the word line. A bit-line restoring circuit is connected to the sense amplifier circuit. The restoring circuit includes a voltage-down converting metal oxide semiconductor field effect transistor having an insulated gate connected to the booster circuit, a drain coupled to the power supply voltage, and a source at which a potentially decreased voltage appears to be lower than the power supply voltage. The voltage-down converting transistor is same in channel conductivity type as the transfer-gate transistor.
A semiconductor memory device comprising:
A dynamic random access memory comprising:
A dynamic random access memory system comprising:
Dependencies are inferred from the claim text.