Electronic component and mounting structure thereof
AssigneeMurata Manufacturing Co., Ltd.
InventorsMasao Yonezawa, Akiyoshi Moriyasu
Life of this patent
Estimating the term…
Abstract
An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.
Claims6
An electronic component comprising:
- a flat shaped substrate;
- a first lead terminal connected to one end of said substrate by grasping said substrate, and led out toward an outside of said substrate so as to be parallel to a surface of said substrate, and a connecting side except a grasping portion and an inserting portion side to an external circuit board of said first lead terminal being in a same plane;
- and
- a second lead terminal connected to said one end of said substrate by grasping said substrate, and led out toward an outside of said substrate, and a connecting side except a grasping portion and an inserting portion side to a circuit board of said second lead terminal being in different planes which are parallel to the surface of said substrate and connected with an oblique portion;
- wherein said first lead terminal has holding portion at an intermediate part of said first lead terminal for preventing said first lead terminal from moving through a hole of said circuit board, and said holding portion and a boundary portion between said oblique portion and said inserting portion side of said second lead terminal are in a same plane substantially perpendicular to the surface of said substrate.
A mounting structure of an electronic component comprising:
- a flat shaped substrate;
- a first lead terminal connected to one end of said substrate by grasping said substrate, and led out toward an outside of said substrate so as to be parallel to a surface of said substrate, and a connecting side except a grasping portion and an inserting portion side to an external circuit board of said first lead terminal being in a same plane;
- and
- a second lead terminal connected to said one end of said substrate by grasping said substrate, and led out toward an outside of said substrate, and a connecting side except a grasping portion and an inserting portion side to said circuit board of said second lead terminal being in different planes which are parallel to the surface of said substrate and connected with an oblique portion;
- wherein an interposing member having a through hole for inserting at least said first lead terminal and having a predetermined thickness and made of insulating material is put on said circuit board, and
- at least said first lead terminal is inserted to a through hole of said circuit board via said interposing member.
Dependencies are inferred from the claim text.