Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending

A method of making a board selected from one of a film carrier, a flexible printed wiring board, and a hard printed wiring board, comprising the following sequential steps:

• (1) punching a part of the board to form at least one slit in the board at a position where the board is to be bent;
• (2) forming a metal laminate on the board that covers the slit;
• (3) etching the metal laminate to create a conductive pattern on the board, a portion of the conductive pattern bridging the slit;
• (4) applying a resin coating to the conductive pattern bridging the slit that is capable of resisting an external load applied during bending of the board;
• (5) curing the resin coating;
• and
• (6) thereafter bending the board at the slit wherein the resin coating protects and reinforces the bridging conductive pattern.

A method of making a board selected from one of a film carrier, a flexible printed wiring board, and a hard printed wiring board, comprising the following sequential steps:

• (1) punching a part of the board to form at least one slit in the board at a position where the board is to be bent;
• (2) forming a metal laminate on the board that covers the slit;
• (3) etching the metal laminate to create a conductive pattern on the board, a portion of the conductive pattern bridging the slit;
• (4) applying a resin coating to the conductive pattern bridging the slit that is capable of resisting an external load applied during bending of the board;
• and
• (5) curing the resin coating;
• wherein the resin coating applied onto the conductive pattern bridging the slit is also applied at the same time onto other areas of the conductive pattern.

A method comprising:

• (1) providing a board selected from one of a film carrier, a flexible printed wiring board, and a hard printed wiring board;
• (2) punching a slit in a part of the board corresponding to a position where the board is to be bent;
• (3) forming a metal laminate on the board;
• (4) etching the metal laminate to form a conductive pattern on said board and over the slit;
• (5) applying a resin coating onto the conductive pattern which is capable of resisting an external load applied during bending of said board;
• (6) curing the resin coating;
• (7) bending the board at the slit;
• and
• (8) installing the bent board in a liquid crystal panel.