US 5,397,917 AGranted

Semiconductor package capable of spreading heat

AssigneeMotorola, Inc.

InventorsDenise M. Ommen, Chi-Taou Tsai, John Baird

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Abstract

A package (10, 37, 39) capable of spreading heat from a semiconductor die (25). The package (10, 37) includes a heat spreader (11) having a thickness of approximately 0.2 millimeters and a plurality of heat spreader clearance holes (16). The heat spreader (11) is coated with an adhesive material (17) which fills the plurality of heat spreader clearance holes (16). A substrate layer (18) is formed on the adhesive material (17). The substrate layer (18) has conductive traces (20, 24) and conductive pads (21) disposed thereon. A cavity (23) may be present in the package (10, 37, 39) which exposes a portion of the heat spreader (11) and is adapted to receive the semiconductor die (25). The cavity (23) is covered by a cavity sealing means (30, 38).

Claims15

Dependent claims

A semiconductor package capable of spreading heat, comprising:

a heat spreader having a first surface, a second surface, and a plurality of clearance holes extending therethrough, each clearance hole having a diameter;
an adhesive material coating the first and second surfaces;
a substrate layer, the substrate layer covering the adhesive material;
a top-side conductive trace, the tope-side conductive trace over the first surface;
a bottom-side conductive trace, the bottom-side conductive trace over the second surface;
a plurality of signal vias, each of the plurality of signal vias within a corresponding clearance hole and spaced apart from edges of the corresponding clearance hole by the adhesive material;
a conductive pad, the conductive pad over the second surface and electrically coupled to the top-side conductive trace via the bottom-side conductive trace and at least one of the plurality of signal vias;
a cavity for receiving a semiconductor die, the cavity exposing the first surface of the heat spreader;
and
a material for covering the cavity for receiving the semiconductor die.

7 more elements

Dependencies are inferred from the claim text.