Semiconductor element mounting die pad including a plurality of extending portions

A resin sealed semiconductor device comprising:

• a semiconductor element mounting die pad;
• a semiconductor element disposed on an upper surface of the semiconductor element mounting die pad;
• leads connecting the semiconductor element through metal fine wires;
• a resin mold portion enveloping at least the semiconductor element and the semiconductor element mounting die pad;
• and
• a plurality of portions:
• each of which is situated below a plane which is situated along a lower surface of said semiconductor element mounting die pad,
• each of which forms a respective passageway extending between said lower surface of said semiconductor element mounting die pad and said upper surface of said semiconductor element mounting die pad, and
• each of which forms a respective space which extends along a longitudinal cross section of the semiconductor element mounting die pad.

A lead frame comprising:

• a tie bar connected to a frame body,
• a semiconductor element mounting die pad connected to the tie bar, and
• a plurality of leads extending toward the semiconductor element mounting die pad,
• a plurality of portions:
• each of which is situated below a plane which is situated along a lower surface of said semiconductor element mounting die pad, and
• each of which forms a respective passageway extending between said lower surface of said semiconductor element mounting die pad and an upper surface of said semiconductor element mounting die pad,
• wherein at least one of said portions is situated at an edge of said semiconductor element mounting die pad.

A resin sealed semiconductor device comprising:

• a semiconductor element mounting die pad,
• a resin mold portion enveloping at least the semiconductor element and the semiconductor element mounting die pad,
• a plurality of leads extending toward the semiconductor element mounting die pad,
• a plurality of portions:
• each of which is situated below a plane which is situated along a lower surface of said semiconductor element mounting die pad, and
• each of which forms a respective passageway extending between said lower surface of said semiconductor element mounting die pad and an upper surface of said semiconductor element mounting die pad,
• wherein at least one of said portions is situated at an edge of said semiconductor element mounting die pad.