Infrared sensor and method for production thereof
AssigneeTerumo Kabushiki Kaisha
InventorsKiyoshi Komatsu, Takehisa Mori, Atsushi Sone, Mitsuteru Kimura
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Abstract
An infrared sensor including a substrate provided with a bridging part; a detecting part composed of an infrared temperature-sensitive film formed in the bridging part; an electrode pad formed of a laminate film and an etchant-resistant electrically conductive film electrically connected to the infrared temperature-sensitive film; a first lid covering the detecting part and the bridging part; and a second lid covering another surface of the substrate and tightly closing a cavity formed between the substrate and the bridging part.
Claims15
An infrared sensor comprising:
- a substrate provided with a bridging part,
- a detecting part composed of an infrared temperature-sensitive film formed in said bridging part,
- an electrode pad formed of a laminate film and an etchant-resistant electrically conductive film electrically connected to said infrared temperature-sensitive film,
- a first lid covering said detecting part and said bridging part, and
- a second lid covering another surface of said substrate and tightly closing a cavity formed between said substrate and said bridging part.
An infrared sensor comprising:
- a substrate;
- a first insulating film provided on a surface of said substrate;
- an infrared temperature-sensitive film formed on a part of said first insulating film;
- a second insulating film formed on said infrared temperature-sensitive film and a remaining part of said first insulating film, said second insulating film provided with a contact hole that reaches said infrared temperature-sensitive film;
- and
- an electrode formed on said second insulating film, said electrode electrically connected to said infrared temperature-sensitive film via said contact hole, and provided, above said second insulating film, with a part of increased width greater than the width of said contact hole.
Dependencies are inferred from the claim text.