Process for hardening active electronic components against ionizing radiations, and hardened components of large dimensions
AssigneeThomson-CSF
InventorsLouis Mercandalli, Didier Pribat, Bernard Dessertenne, Leonidas Karapiperis, Dominique Dieumegard
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Abstract
The invention relates to the "hardening" (resistance to ionizing radiations) of MOS-type components. In order to avoid the effects of these radiations (creation of electron-hole pairs), there is deposited on a substrate (1) of monocrystalline Si a layer of YSZ (2), and then a thin layer of monocrystalline Si (3). The other steps of production of the components are the same as conventional.
Claims20
Process for hardening substrates for active electronic components of large dimensions against ionizing radiations, characterized in that their basic structure is produced by forming on a surface of a substrate of monocrystalline silicon having at least one dimension in excess of 50 mm (1) a layer (2) of "hardening" material of polycrystalline stabilized zirconia exhibiting a product .mu...delta. of less than approximately 5.10.sup.-8 cm.sup.2.V.sup.1, .mu. being the mobility, expressed in cm.sup.2.V.sup.1 s.sup.-1, of the carriers photogenerated under ionizing radiation, and .delta. their lifetime expressed in seconds, and in that a layer of monocrystalline silicon (3) is formed on this layer of "hardening" material.
Process according to any one of the preceding claims, characterized in that in order to form the layer of monocrystalline silicon, openings are engraved in the zirconia, baring surfaces (2A) of the substrate to constitute nucleation zones, then a continuous film of silica (4') is formed, then there are made in this silica film openings (4A) corresponding to those made in the zirconia, and in that monocrystalline silicon (5) is deposited in the openings (4A) which have bared the monocrystalline silicon of the substrate, and polycrystalline silicon (6) on the silica film.
Dependencies are inferred from the claim text.