Polyimide precursor and photosensitive composition containing the same

Abstract

Disclosed is a novel polyimide precursor having an aromatic polyamide ester structure containing amido groups and carboxylic acid ester groups composed of carboxylic groups and organic groups bonded thereto by ester linkage, wherein the ester groups comprise 20 to 80 mole %, based on the total molar amount of the ester groups, of groups each independently selected from the group consisting of a methyl group, an ethyl group, an n-propyl group, an isopropyl group and an allyl group and 20 to 80 mole %, based on the total molar amount of the ester groups, of organic groups each independently selected from organic groups having 4 to 11 carbon atoms and containing a terminal ethylenic double bond. The polyimide precursor of the present invention has excellent pattern forming properties and can be converted by heating to a cured polyimide resin having excellent mechanical properties including excellent elongation, and a high water resistance and, therefore, is useful as a raw material for the production of electrical and electronic parts, such as semiconductor devices, multi-layer wiring boards, etc. Disclosed is also a photosensitive resin composition containing this novel polyimide precursor, which is particularly useful for forming a patterned polyimide resin film with a high pattern resolution.

Dependencies are inferred from the claim text.