Semiconductor product plating apparatus

A semiconductor product plating apparatus comprising:

• a first housing having a first projecting mask portion for masking a first surface of a resin package of a resin-encapsulated semiconductor device and a second projecting mask portion for masking a first surface of a peripheral portion of a lead frame, electrolytic solution supply slits and electrolytic solution drainage slits being formed in housing portions between said first and second mask portions;
• a second housing having a third projecting mask portion for masking a second, opposing surface of said resin package of said resin-encapsulated semiconductor device and a fourth projecting mask portion for masking a second, opposing surface of the peripheral portion of said lead frame, electrolytic solution supply slits and electrolytic solution drainage slits being formed in housing portions between said third and fourth mask portions, and said second housing being formed so as to be movable closer to and further away from said first housing and forming hollow portions surrounding outer leads when moving closer to said first housing to clamp and hold both the surfaces of said resin package of said semiconductor device and those of the peripheral portion of said lead frame together with said first housing;
• electrodes formed on inner wall surfaces of said housing portions of said first and second housing;
• a power supply unit for applying a positive voltage to said electrodes and a negative voltage to said outer leads between said semiconductor device and the peripheral portion of said lead frame;
• and
• an electrolytic solution supply unit for supplying an electrolytic solution to said electrolytic solution supply slits from outside of said first and second housings.