Method of manufacturing photoluminescing porous silicon using spark erosion
AssigneeUniversity of Florida
InventorsRolf E. Hummel, Sung-Sik Chang
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Abstract
A high frequency, high voltage spark generator is used to create a large number of sparks to erode the surface of a silicon wafer to a depth of up to 100 microns. After a sufficient amount of erosion has occurred, but prior to any macro-scale removal of material, the surface layer of the silicon wafer becomes porous and photoluminescing. The method can be performed in ambient atmosphere and temperature, or in specific gas atmospheres and at different temperatures. The method produces photoluminescing porous silicon layers on p-type, n-type, low-doped, high-doped or undoped silicon wafers.
Claims10
A method for the manufacture of a photoluminescing porous silicon layer on a silicon wafer substrate comprising the steps of:
- (A) providing a high voltage, high frequency spark generator capable of delivering a high number of sparks to the surface of a silicon wafer substrate;
- (B) eroding a portion of the surface of a silicon wafer substrate to a depth of less than 100 microns by the application of a high number of sparks to said silicon wafer surface to create a porous surface layer.
Dependencies are inferred from the claim text.