Multi-head die bonding system
AssigneeKulicke and Soffa Industries, Inc.
InventorsGeorge H. Bantz, Jeffrey A. LaPat
Life of this patent
Estimating the term…
Abstract
A multi-tool bonder having a plurality of die heads flexibly mounted on a conveyor which spaces and moves the heads along a path which includes a plurality of die processing stations. An alignment mechanism is provided at each stationary processing station for aligning the head at a fixed position along the path at the station. A controller controls the conveyor to position the plurality of heads at the stations and controls operation of the heads at the stations.
Claims20
An apparatus for bonding an electronic die to a substrate and including a die supply station, a bonding station, at least one processing station between said die supply station and said bonding station, and die transport means for transporting dies along a path between said stations, said die transport means comprising:
- a plurality of head means each for holding a die;
- conveyor means including two vertically spaced and coaxial endless belts for spacing and moving said plurality of head means along a closed loop including said path;
- alignment means at each of said stations for aligning said head means at a fixed position along said path in two orthogonal directions at said stations independently of said conveyor means;
- and
- control means for controlling said conveyor means to position said plurality of head means at said stations and controlling said head means at said stations.
An apparatus for bonding an electronic die to a substrate and including a die supply station, a bonding station, at least one processing station between said die supply station and said bonding station, and die transport means for transporting dies along a path between said stations, said die transport means comprising:
- a plurality of head means each including a head housing and a head for holding a die using a vacuum;
- a conveyor means including at least one endless belt for spacing and moving said plurality of head means along said path;
- mounting means for mounting said head means to said endless belt;
- alignment means at each of said stations for engaging said head housing and aligning said head means at a fixed position along said path in two orthogonal directions at said stations;
- first drive means for mating with said head at a station and rotating said head relative to said mounting means about a vertical axis;
- second drive means for mating with said head at a station and raising and lowering said head to said mounting means;
- connection means for connecting a source of a vacuum to each of said heads such that said head rotates relative to said connection means and is fixed vertically relative to said connection means;
- and
- control means for controlling said conveyor means to position said plurality of head means at said stations, controlling said first and second drive means and controlling said vacuum to hold and release a die.
An apparatus for bonding an electronic die to a substrate and including a die supply station, a bonding station, at least one processing station between said die supply station and said bonding station, and die transport means for transporting dies along a path between said stations, said die transport means comprising:
- a plurality of head means each for holding a die;
- conveyor means for spacing and moving said plurality of head means along said path;
- clamping means at each of said stations and having at least a first and a second jaws movable relative to each other transverse to said path for clamping said head means at a fixed position along said path at said stations;
- and
- control means for controlling said conveyor means to position said plurality of head means at said stations and controlling said head means at said stations.
Dependencies are inferred from the claim text.