Semiconductor apparatus covered with a sealing resin composition
AssigneeCanon Kabushiki Kaisha
InventorsHitoshi Toma, Toshihiko Mimura, Nobuyoshi Takehara, Koji Tsuzuki
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AssigneeCanon Kabushiki Kaisha
InventorsHitoshi Toma, Toshihiko Mimura, Nobuyoshi Takehara, Koji Tsuzuki
Estimating the term…
A sealing material exhibiting excellent sealing performance while keeping a satisfactory balance between a variety of characteristics is provided so that the sealing structure is simplified and the quantity of the sealing material is reduced. As a result, a solar cell, the cost of which can significantly be reduced and which can be operated stably for a long time while exhibiting excellent performance can be provided. A suitable resin composition for sealing contains at least a hardening resin and a thermoplastic resin which has a number average molecular weight larger than the number average molecular weight of the hardening resin and which is soluble in the hardening resin.
A sealed semiconductor device comprising:
A sealed semiconductor device comprising:
A semiconductor device comprising at least a portion of said semiconductor device being coated with a resin composition for sealing, said sealing composition comprising:
Dependencies are inferred from the claim text.