Organic vehicle for electronic composition

A composition suitable for attaching a metallic lead of electronic component to a metallization on a printed wiring board, wherein at least the lead or the printed wiring board metallization is precoated with solder, the composition comprising:

• a liquid formulation of
• a) at least one compound having a molecular weight of about 200 to about 500 of the structure, ##STR13## or the structure, ##STR14## or the structure, ##STR15## or the structure, ##STR16## where R.sub.1 through R.sub.8, are independently selected from the group consisting of hydrogen, phenyl, alkyl groups containing 1 to 10 carbon atoms, and cycloalkyl groups containing 5 to 10 carbon atoms, with the proviso that at least one of R.sub.1 and R.sub.2 is different than hydrogen and at least one of R.sub.3 and R.sub.4 is hydrogen;
• X.sub.1 through X.sub.5, Y.sub.1 through Y.sub.5, Z.sub.1 through Z.sub.5, are independently selected from the group consisting of hydrogen, phenyl, alkyl, cycloalkyl, acyl, alkoxyl, carboxyl, carboxyl ester, and hydroxyl;
• and wherein said group each contains 10 or fewer carbon atoms;
• and
• n is 1 or 2;
• and
• b) an activator.