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US 5,397,241 AGranted
High density electrical connector
AssigneeAT&T Corp.
InventorsLoren A. Cox, Michael G. German, Constance R. Pallas
Life of this patent
Estimating the term…
Abstract
Disclosed is a high density connector for providing electrical connection between a circuit pack and backplane. The connector is formed from at least two modules, each coupled to a different surface of the circuit board and having a different array of connection types.
Claims7
An electrical connector mounted to a printed circuit board and comprising:
- a first module located adjacent to one major surface of the circuit board and including an insulating housing having a front and back surface, an array of first conductive elements of one type mounted therein, wherein said first conductive elements couple to and a first plurality of right angle electrical leads extending from the back surface and mounted to the one major surface of the circuit board;
- and
- a second module located adjacent to an opposite major surface of the circuit board and including an insulating housing having a front and back surface, an array of second conductive elements of a different type than those in the first module mounted therein, wherein said conductive elements extending through the back surface and being bent at right angles, ends of said second conductive elements couple to a second plurality of electrical leads mounted to the opposite major surface of the circuit board, the second plurality of leads and the ends of said second conductive elements being mounted to an area of the circuit board farther removed from the back surfaces of the modules at a greater distance than the first plurality of leads.
Dependencies are inferred from the claim text.