Package for a semiconductor device including a lead shaping assembly
OwnerRichard H. J. Fierkensinventor
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Abstract
A semiconductor device comprising a semiconductor unit with leads extending therefrom is placed on a bottom packaging tray having a die-shaped upper surface. A top lubricating type film is used over the device 10 and below a punch unit that is used to bend the leads. A process of assembling the semiconductor device on a die type package is disclosed which includes placing the semiconductor device with leads on a packaging tray with upper lead-shaped baring surfaces, placing an anti-friction film sheet over the tray and over the device with its leads extending therefrom, and actuating a punch unit disposed above the film sheet, thereby forming or bending the leads and simultaneously using the die type tray for packaging the semiconductor device.
Claims3
An apparatus including a package for a semiconductor device and including a lead shaping assembly comprising, in combination:
- a packaging tray having a die-shaped upper surface;
- a semiconductor device disposed upon the tray upper surface and having a plurality of leads, each of said plurality of leads being shaped by and in conformity with said die-shaped upper surface of said packaging tray, said upper surface of said tray providing a raised projection having a flat upper portion in contact with a bottom surface portion of each of said plurality of leads, and having a sloped portion extending downwardly from said flat upper portion of said raised projection and also in contact with said bottom surface portion of each of said plurality of leads, and
- punch means comprising a punch providing at least three contiguous surface portions in coupled contact with an upper surface portion of each of said plurality of leads for shaping each of said plurality of leads to conform to at least said flat upper portion of said raised projection and to said sloped portion of said raised projection.
Dependencies are inferred from the claim text.