Method for packaging an integrated circuit
AssigneeTexas Instruments Incorporated
InventorErnest J. Russell
Life of this patent
Estimating the term…
Abstract
The present invention provides a modular electronic component (10) wherein a sequence of leads (26) of a lead frame (12) differs from a sequence of bonding pads (16) on an integrated circuit (14). When lead frame (12) is placed adjacent integrated circuit (14), first and second power buses (22) and (24) are disposed on a first side (18) of bonding pads (16). First portion (30) of leads (26) and lead finger (28) are disposed on second side (20) of bonding pads (16). Bonding members (42) couple appropriate bonding pads (16) with corresponding leads (26), first and second power buses (22) and (24), and lead finger (28). In this manner, the pin out of modular electronic component (10) may be altered by incorporating appropriate lead fingers (28) without changing the sequence of bonding pads (16).
Claims5
A method for packaging an integrated circuit having a row of bonding pads, the method comprising the steps of:
- forming a lead frame including first and second power busses mutually parallel along a portion of said busses, a plurality of leads having first and second ends, and at least one lead finger having first and second ends;
- placing the lead frame adjacent the integrated circuit such that the portion of the first and second power buses is disposed adjacent a first side of the row of bonding pads, parallel to the bonding pads, the second end of the leads are disposed adjacent a second side of the row of bonding pads, and each of the leads and the lead fingers are adjacent an appropriate bonding pad.
Dependencies are inferred from the claim text.