US 5,396,334 AGranted

Bonding wire inspection apparatus

AssigneeKabushiki Kaisha Shinkawa

InventorKenji Sugawara

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Abstract

A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: a vertical illuminator that illuminates an object of inspection from above; an optical assembly that images particular portions of the object such as the ball at one end of a wire and the crescent at another end of the wire, by receiving the light that is emitted from the vertical illuminator and reflected by the object; a camera that photographs the image obtained by the optical assembly; and a diaphragm that is provided beneath the vertical illuminator and electrically changeable in its opening diameter. Thus, by adjusting the opening diameter of the diaphragm, clear images of the object are constantly obtained despite the differences of surface smoothness of the portions to be inspected.

Claims1

Dependent claims

A bonding wire inspection apparatus that inspects wires bonded between the pads of a semiconductor chip and the leads of a lead frame comprising:

a vertical illumination means that illuminates an object of inspection from above;
an optical means that images particular portions of said object by receiving light that is from said vertical illuminating means and reflected by said object;
a camera means that photographs the images obtained by said optical means;
and
a diaphragm means provided beneath said vertical illumination means, the opening diameter of said diaphragm means being electrically changeable;
and wherein
said camera means comprises a low magnification camera and a high magnification camera;
and
said diaphragm means comprises a first diaphragm provided only between said vertical illuminating means and an object, a second diaphragm provided between said object and said low magnification camera and said high magnification camera and a third diaphragm provided between said second diaphragm and said high magnification camera, said first, second and third diaphragms all being independently electrically changeable.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 07/983,650Filed 1 Dec 1992
Priority: JP 3-3418332 Dec 1991
Granted: 7 Mar 1995
Term ends: Not estimatedThe source records don’t support an estimate.

Classification24 codes

G01N 21/8806
Investigating the presence of flaws or contamination: specially adapted optical and illumination features
G01R 31/2853
Testing of integrated circuits [IC]: electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
G01R 31/311
Using non-ionising electromagnetic radiation, e.g. optical radiation: of integrated circuits
G01N 2021/887
Using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing: the measurements made in two or more…