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US 5,396,332 AGranted
Apparatus and method for measuring the thickness of a semiconductor wafer
OwnerTheodoer F. Ciszekinventor
Life of this patent
Estimating the term…
Abstract
Apparatus for measuring thicknesses of semiconductor wafers, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light.
Claims8
Apparatus for optically measuring thickness of a static semiconductor wafer having a thickness of 50 microns or less, comprising:
- housing means for supporting said wafer in a light-tight environment;
- a light source mounted to said housing at one side of said wafer to emit light of a predetermined wavelength of from about 640 to about 1300 nm to normally impinge said wafer;
- a light detector supported at a predetermined distance from a side of said wafer opposite said side on which a light source impinges and adapted to receive light transmitted through said wafer;
- and
- means for measuring said transmitted light as voltage vs thickness of the measured wafer.
2 more elements
Dependencies are inferred from the claim text.