Apparatus and method for cleaning a substrate in a printing apparatus
AssigneeXerox Corporation
InventorClark V. Lange
Life of this patent
Estimating the term…
Abstract
An electrostatic printer having a cleaning blade for removing residual particles from the surface of a photoconductive substrate. A mechanism automatically retracts the cleaning blade away from the substrate to avoid scrapping the cleaning blade against a seam on the substrate.
Claims32
An apparatus comprising:
- a substrate having a substantially uniform surface portion, and a nonuniform surface portion;
- a particle remover for removing particles from the substrate;
- means for moving the substrate relative to the particle remover;
- and
- means for moving the particle remover away from the substrate when the nonuniform surface portion of the substrate passes the particle remover.
A method of operating an apparatus including a substrate having a substantially uniform surface portion, and a nonuniform surface portion, and a particle remover for removing particles from the substrate, the method comprising the steps of
- moving the substrate relative to the particle remover;
- and
- moving the particle remover away from the substrate when the nonuniform surface portion of the substrate passes the particle remover.
An apparatus comprising:
- a moveable substrate;
- a cam on the substrate;
- and
- a particle remover for removing particles from the substrate, the particle remover being engageable with the cam to move away from the substrate.
An assembly for a printing apparatus, the assembly comprising:
- a moveable substrate having a seam;
- cleaning means engageable with the substrate;
- and
- means for disengaging the cleaning means from the substrate when the seam passes between the substrate and the cleaning means.
An apparatus comprising:
- a substrate having a substantially uniform surface portion, and a nonuniform surface portion;
- a subassembly;
- a particle remover, coupled to the subassembly, for removing particles from the substrate;
- means for moving the substrate relative to the subassembly;
- and
- means for moving the subassembly away from the substrate when the nonuniform surface portion of the substrate passes the particle remover.
A method of operating an apparatus including a substrate having a substantially uniform surface portion, and a nonuniform surface portion, a subassembly, and a particle remover, coupled to the subassembly, for removing particles from the substrate, the method comprising the steps of
- moving the substrate relative to the subassembly;
- and
- moving the subassembly away from the substrate when the nonuniform surface portion of the substrate passes the subassembly.
An apparatus comprising:
- a moveable substrate;
- a cam on the substrate;
- a subassembly engageable with the cam to move away from the substrate;
- and
- a particle remover, coupled to the subassembly, for removing particles from the substrate.
An apparatus comprising:
- a substrate having a substantially uniform surface portion, and a nonuniform surface portion;
- a particle remover for removing particles from the substrate, by applying a pressure to the substrate;
- means for moving the substrate relative to the particle remover;
- and
- means for causing the particle remover to reduce the pressure when the nonuniform surface portion of the substrate passes the particle remover.
A method of operating an apparatus including a substrate having a substantially uniform surface portion, and a nonuniform surface portion, and a particle remover for removing particles from the substrate by applying a pressure to the substrate, the method comprising the steps of:
- moving the substrate relative to the particle remover;
- and
- causing the particle remover to reduce the pressure when the nonuniform surface portion of the substrate passes the particle remover.
An assembly for a printing apparatus, the assembly comprising:
- a moveable substrate having a seam;
- means for applying a pressure to the substrate;
- and
- means for causing the applying means to reduce the pressure when the seam passes between the substrate and the applying means.
Dependencies are inferred from the claim text.