Anodic bonding process and method of producing an ink-jet print head using the same process

A method of producing an ink-jet print head, the method comprising the steps of:

• providing a first substrate having a surface including a plastic material;
• providing a second substrate having a surface made from glass, the glass having a low melting point;
• forming a conductive film on the surface of the first substrate;
• positioning the first and second substrates one above another after the conductive film has been formed on the surface of the first substrate so that the surfaces face each other;
• applying pressure and heat to the substrates;
• and
• applying a voltage between the first and second substrates while subjecting the substrates to pressure and heat.

A method for making an apparatus having an ink-jet print head, the method including the steps of:

• providing a head base including a plurality of individual ink passages formed therein,
• providing a vibrating plate to be joined to said head base, wherein one of the head base and vibrating plate includes plastic, wherein one of the vibrating plate and the head base has a surface including glass, and the other of the vibrating plate and the head base has a surface including an electrically conductive material, wherein one of the vibrating plate and head base includes plastic,
• superposing said head base and vibrating plate one above another,
• thereafter applying a voltage between said head base and vibrating plate to carry out anodic bonding while being subjected to pressure and heat.

A method of producing an ink-jet print head by anodic bonding first and second substrates to each other, said method comprising the steps of:

• providing a first substrate having a conductive material on a first surface so that the first substrate can function as an anode;
• providing a second substrate having a glass material on a second surface so that the second substrate can function as a cathode, wherein the one of the first and second substrates includes plastic;
• superposing the first and second substrates one above another so that the first surface faces the second surface;
• and
• applying a voltage between said first and second substrates while subjecting the first and second substrates to pressure and heat.