Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
AssigneeDelco Electronics Corporation
InventorsBruce A. Myers, Dwadasi H. R. Sarma, Anil K. Kollipara, Ponnusamy Palanisamy
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Abstract
Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.
Claims13
A microelectronic device having enhanced lateral heat dissipation characteristics, said device comprising:
- an alumina substrate;
- a heat generating component supported by said alumina substrate;
- a solder layer underlying said heat generating component;
- and
- an ultra-thick thick film having a thickness ranging from about 2 to about 5 mils interposed between said solder layer and said alumina substrate, said ultra-thick thick film being secured to said alumina substrate;
- whereby said thickness of said ultra-thick thick film promotes lateral heat dissipation from said heat generating component and to said alumina substrate.
A microelectronic device having enhanced lateral heat dissipation characteristics, said device comprising:
- an alumina substrate;
- a heat generating component supported by said alumina substrate;
- a first solder layer underlying said heat generating component;
- a first ultra-thick thick film having a thickness ranging from about 2 to about 5 mils, said first ultra-thick thick film being disposed between said first solder layer and said alumina substrate, said first ultra-thick thick film being secured to said alumina substrate;
- a second ultra-thick thick film having a thickness ranging from about 2 to about 5 mils underlying said alumina substrate;
- and
- a second solder layer underlying said second ultra-thick thick film, and a heat sink underlying said second solder layer such that said second Solder layer adheres said second ultra-thick thick film to said heat sink;
- whereby said thicknesses of said first and second ultra-thick thick films promote lateral heat dissipation from said heat generating component to said alumina substrate.
A microelectronic device having enhanced lateral heat dissipation characteristics, said device comprising:
- an alumina substrate;
- an integrated circuit chip supported by said alumina substrate, said integrated circuit chip having a length and a width;
- a solder layer underlying said integrated circuit chip so as to be disposed between said integrated circuit chip and said alumina substrate;
- a first ultra-thick thick film disposed between said solder layer and said alumina substrate, said first ultra-thick thick film having a thickness ranging from about 2 to about 5 mils, said first ultra-thick thick film having a length and width which is greater than said length and width, respectively, of said integrated circuit chip;
- a second ultra-thick thick film underlying said alumina substrate, said second ultra-thick thick film having a thickness ranging from about 2 to about 5 mils, said second ultra-thick thick film having a length and width which is greater than said length and width, respectively, of said integrated circuit chip;
- a thermally conductive adhesive layer underlying said second ultra-thick thick film;
- and
- a backplate underlying said thermally conductive adhesive layer such that said alumina substrate and said second ultra-thick thick film are adhered to said backplate said thermally conductive adhesive layer;
- whereby said thicknesses of said first and second ultra-thick thick films promote lateral heat dissipation from said integrated circuit chip to said alumina substrate.
A microelectronic device having enhanced lateral heat dissipation characteristics, said device comprising:
- an alumina substrate;
- an electronic component supported by said alumina substrate;
- an ultra-thick thick film having a thickness ranging from about 2 to about 5 mils, said ultra-thick thick film being secured to said alumina substrate so as to be disposed between said electronic component and said alumina substrate;
- a wire having a first end thereof connected to said electronic component and having an opposite end thereof bonded to said ultra-thick thick film;
- whereby said thickness of said ultra-thick thick film promotes lateral heat dissipation from said wire to said alumina substrate.
Dependencies are inferred from the claim text.