Method of and apparatus for depositing solder on a printed circuit board
AssigneeInternational Business Machines Corporation
InventorsJohn Brown, Kenneth Murray, James McNee, Brian Robertson
Life of this patent
Estimating the term…
Abstract
Solder is deposited on a printed circuit board by melting the solder in a container. The container has a slot for passage of solder, therethrough and control means actuable to alternately allow and prevent passage of solder through the slot. The slot is placed in contact with a stencil and the control means is actuated to allow passage of solder through the slot. The stencil is moved relative to the container in a direction transverse of the slot to deposit solder on the printed circuit board via the stencil.
Claims18
A method of depositing plural distinct solder patterns on a plurality of printed circuit boards, comprising the steps of:
- storing solder in a container having at least one slot therein to allow passage of the solder therethrough;
- placing the slot in contact with at least a first and second stencil each mounted on an endless flexible web including solder resistant material, said at least first and second stencils having a distinct pattern;
- selectively controlling passage of solder through the slot;
- and
- continuously moving the at least first and second stencils and at least a first and second corresponding printed circuit board, in aligned relation, relative to the container in a direction transverse to the slot to deposit said solder on the first printed circuit board via the first stencil and the second printed circuit board via the second stencil;
- wherein said plural distinct solder patterns are continuously formed on said plurality of printed circuit boards.
An apparatus for depositing plural distinct solder patterns on a plurality of printed circuit boards, comprising:
- means for storing solder in a container having at least one slot therein to allow passage of the solder therethrough;
- means for biasing the slot to contact at least a first and second stencil each mounted on an endless flexible web including plurality of stencils including a solder resistant material, said at least first and second stencils having a distinct pattern;
- means for selectively controlling passage of solder through the slot;
- and
- means for continuously moving the at least first and second stencils and at least a first and second corresponding printed circuit board, in aligned relation, relative to the container in a direction transverse to the slot to deposit said solder on the first printed circuit board via the first stencil and the second printed circuit board via the second stencil;
- wherein said plural distinct solder patterns are continuously formed on said plurality of printed circuit boards.
Dependencies are inferred from the claim text.