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US 5,395,038 AGranted
High placement accuracy wire bonder for joining small closely spaced wiring features
AssigneeInternational Business Machines Corporation
InventorsStephen A. F. Olson, Benoit Ventimiglia
Life of this patent
Estimating the term…
Abstract
An automated wire bonding tool for interconnecting circuit pads on microelectronic circuit devices and substrates. A single application of the bonding tool spans both bond sites with the wire being held under the bond tool and gripped at both ends while bonding the wire to both bond sites simultaneously and with high placement accuracy.
Claims9
A wire bonding tool comprising:
- a pair of arms,
- actuable means for rotating said arms about a common axis,
- a positionable bonding tool which is brought to said axis when said tool is in its bonding position,
- a source of wire,
- a wire guide and a wire clamp secured thereto and mounted at the end of each arm adjacent said axis,
- said wire passing through each said wire guide and clamp and said axis, and
- a positionable table supporting a workpiece having a pair of pads across which a segment of said wire is to be bonded,
- said bonding tool having a width sufficient to span the distance between said pads,
- said table supporting said workpiece beneath said tool so that said pads can be brought into contact with said wire segment and said tool when said tool is in said bonding position.
6 more elements
A wire bonding tool comprising:
- a pair of arms,
- actuable means for rotating said arms about a common axis,
- a positionable bonding tool which is brought to said axis when said tool is in its bonding position,
- a source of wire,
- a wire guide and a wire clamp secured thereto and mounted at the end of each arm adjacent said axis,
- said wire passing through each said wire guide and clamp and said axis,
- a workpiece having a pair of pads across which a segment of said wire is to be bonded,
- said bonding tool having a width sufficient to span the distance between said pads, and
- a positionable table supporting said workpiece beneath said tool so that said pads can be brought into contact with said wire segment and said tool when said tool is in said bonding position.
6 more elements
A method of bonding a wire simultaneously to a pair of pads using a bonding tool having a bonding surface sufficiently wide to span the distance between said pads comprising:
- clamping said wire at both ends using a pair of clamps,
- moving said tool into engagement with one side of said wire intermediate said clamps,
- moving said clamps so as to bend said wire about said bonding surface,
- moving said pads so as to engage the other side of said wire at the location of said bonding surface, and
- bonding said wire to said bonding surface.
2 more elements
Dependencies are inferred from the claim text.