Method and apparatus for performing wire bonding by using solder wire
AssigneeRohm Co., Ltd.
InventorsHiroyuki Takahashi, Shinichi Fujino, Kazuhiro Sakamoto, Tomoyasu Hirano
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Abstract
A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.
Claims13
A wire bonding method for electrically connecting a solder wire to at least one bonding portion of a workpiece, the method comprising the steps of:
- forming an upward stream of an oxygen-free gas from below a vertically movable capillary tool, the capillary tool being capable of continuously supplying a material solder wire;
- causing a thermal melting means to form a lower ball end of the material solder wire in the oxygen-free gas stream;
- and
- lowering and then raising the capillary tool for bonding the lower ball end of the material solder wire to said one bonding portion of the workpiece in the oxygen-free gas stream.
Dependencies are inferred from the claim text.