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AssigneeInternational Business Machines Corporation
InventorsMark E. Ferguson, Kenneth J. Guskie, Leon S. Nguyen, Joseph D. Poole, Stuart L. Young, Simon Yu
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Disclosed is a method of populating printed circuit boards with surface mount technology devices in a multi-board work board holder. The method includes the steps placing the printed circuit boards into a multi-board work board holder having a plurality of apertures corresponding to the individual printed circuit boards. The multi-board work board holder is placed onto a surface mount technology production line, and solder paste is selectively applied onto contact pads on surfaces of the printed circuit boards. Integrated circuit chips are next placed onto the solder paste bearing surface of the printed circuit boards, with the contact leads of the integrated circuit chips bearing on deposited solder paste. The printed circuit boards and the work board holder are heated to the reflow temperature of the solder. The x-y plane and z axis coefficients of thermal expansion of the multi-board work board holder are matched to the x-y plane and z-axis coefficients of thermal expansion of the printed circuit boards to avoid warpage and misalignment of the printed circuit boards.
In a method of populating a plurality of printed circuit boards with surface mount technology devices in a multi-board work board holder, comprising the steps of:
A method of attaching a relatively high coefficient of thermal expansion electrical connector interface to a relatively low coefficient of thermal expansion printed circuit board, including the steps of selectively applying solder paste onto contact pads on a surface Of the printed circuit board, placing integrated circuit chips onto the solder paste bearing surface of the printed circuit board, with contact leads of the integrated circuit chips bearing on deposited solder paste, heating the printed circuit board from ambient temperature to the reflow temperature of the solder to reflow the solder in the solder paste and provide electrical and mechanical connection between the integrated circuit chips and the printed circuit boards, the method of interface attachment comprising:
Dependencies are inferred from the claim text.