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AssigneeHitachi Maxwell, Ltd.
InventorsTakeshi Tottori, Satoshi Yamagata, Kazunari Nakagawa, Toshiharu Ochiai
Estimating the term…
A fabricating method of a laminated semiconductor device wherein two or more semiconductor chips are stacked as tape carrier packages and the tape carrier packages are mounted on at least one side of the printed wiring board so that outer connection leads provided in the tape carrier packages are stacked to be connected to the terminal porions of the printed wiring package, which includes stacking two or more tape carrier packages and aligning the outer connection leads of the tape carrier packages in the stacked direction, temporarily bonding the stacked outer connection leads to one another to combine the stacked tape carrier packages into one block, and placing the block on the printed wiring board and passing the terminal portions formed on the printed wiring board and lowermost outer connection leads of the block through a heating furnace to thereby solder them.
A method of fabricating a laminated semiconductor device including two or more semiconductor chips stacked as IC packages and mounted on at least one side of a printed wiring board and outer connection leads provided in said IC packages and stacked to be connected to terminals of said printed wiring board, comprising:
Dependencies are inferred from the claim text.