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US 5,394,607 AGranted
Method of providing low cost heat sink
AssigneeTexas Instruments Incorporated
InventorsTony Chiu, Robert Alvarez
Life of this patent
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Abstract
The invention disclosed herein is a device and method in which a heat sink (22) is attached to support leads (18) of a leadframe (10) via a welding or mechanical joining technique. The method is performed prior to semiconductor device packaging and is usually performed after the leadframe is etched or stamped, and before it is cut into strips.
Claims18
A method, comprising:
- providing a lead frame having lead fingers and multiple support leads each having an end integral with said lead frame and a free end;
- providing one and only one heat spreader per lead frame;
- and
- attaching said heat spreader to said free ends of said support leads.
1 more element
A method, comprising:
- providing a lead frame having lead fingers and support leads each having an end integral with said lead frame and a free end, said support leads not extending into said lead fingers;
- providing a heat spreader;
- and
- attaching said heat spreader to said free ends of said support leads.
1 more element
Dependencies are inferred from the claim text.