Bonding wire inspection apparatus and method
AssigneeKabushiki Kaisha Shinkawa
InventorKenji Sugawara
Life of this patent
Estimating the term…
Abstract
An apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: an illuminating assembly that emits lights, via LED's that are arranged in a ring-shape, onto the object of inspection such as the ball at the end of a bonded wire; an optical assembly that images the object of inspection which is illuminated by the illumination assembly, and cameras that photograph the image taken in by the optical assembly. When the ball, particularly its shape, is inspected, a dark field illumination circumstance is created by the illuminating assembly so that only the ball can appear bright. In this case, a diaphragm of the optical assembly is also adjusted so as to create a shallow focal depth for the ball.
Claims4
A bonding wire inspection apparatus that inspects wires bonded between the pads of a semiconductor chip and the leads of a lead frame comprising:
- a ring-form illumination means made up of plural LED's arranged in a ring shape so as to illuminate an object of inspection at inclined angles to provide dark field illumination;
- a vertical illuminator for illuminating said object to provide bright field illumination;
- an optical means that receives light reflected by said object and images said object;
- and
- cameras that photograph the image taken in by said optical means;
- and wherein
- said optical means further comprises a diaphragm means provided only in an optical path of said cameras, said diaphragm means having variable opening diameter to provide a wide opening for shallow optical depth of focus or a small opening to provide a large optical depth of field of focus.
Dependencies are inferred from the claim text.