Air cooling fan arrangement in a microwave heating device

A microwave heating device, comprising:

• a heating chamber having a side wall;
• a mechanical chamber adjacent to said side wall of said heating chamber, said mechanical chamber having a bottom wall with an air suction port therein at a lower part thereof;
• a magnetron provided in said mechanical chamber for radiating microwave energy to material to be heated in said heating chamber;
• a high frequency power supply adapted to supply microwave electric power to said magnetron, said high frequency power supply being positioned in proximity to and parallel with said magnetron and positioned perpendicular to said side wall of said heating chamber in said mechanical chamber, and said high frequency power supply comprising a power control semiconductor device and a high voltage transformer;
• an air feeding device provided in the lower part of said mechanical chamber adapted to form a cooling air flow through said air suction port for cooling said magnetron and said high frequency power supply, said air feeding device comprising a propeller fan driven by a motor, and said propeller fan having a vertical axis of rotation and a direction of rotation;
• a control adapted to control said magnetron and said high frequency power supply;
• wherein said power control semiconductor device and said high-voltage transformer are disposed in proximity to said air feeding device in the cooling air flow, said power control semiconductor device being positioned first, before said high-voltage transformer, in the direction of rotation of said propeller;
• a first frame in said mechanical chamber having a casing member in which said air feeding device is securely fixed and a first guide wall;
• a second frame on which said high frequency power supply is disposed and having a second guide wall;
• wherein said first and second frames are connected together at a connecting portion and fixed in an approximate L shape, and wherein said first and second guide walls define an airflow path for the cooling air flow for cooling said high frequency power supply;
• and
• wherein said first guide wall comprises an extension of said casing member of said first frame, and has a height approximately equal to the level of said power control semiconductor device and said high-voltage transformer, said first guide wall having a top portion in proximity to a cooling path of said magnetron, and wherein said second guide wall is in proximity to said first guide wall so as to surround said power control semiconductor device and said high-voltage transformer.

A microwave heating device, comprising:

• a heating chamber having a side wall;
• a mechanical chamber adjacent to said side wall of said heating chamber, said mechanical chamber having a bottom wall with an air suction port therein at a lower part thereof;
• a magnetron provided in said mechanical chamber for radiating microwave energy to material to be heated in said heating chamber;
• a high frequency power supply adapted to supply microwave electric power to said magnetron, said high frequency power supply being positioned in proximity to and parallel with said magnetron and positioned perpendicular to said side wall of said heating chamber in said mechanical chamber, and said high frequency power supply comprising a power control semiconductor device and a high voltage transformer;
• an air feeding device provided in the lower part of said mechanical chamber adapted to form a cooling air flow through said air suction port for cooling said magnetron and said high frequency power supply, said air feeding device comprising a propeller fan driven by a motor, and said propeller fan having a vertical axis of rotation and a direction of rotation;
• a control adapted to control said magnetron and said high frequency power supply;
• a first frame in said mechanical chamber having a casing member in which said air feeding device is securely fixed and a first guide wall;
• a second frame on which said high frequency power supply is disposed and having a second guide wall;
• wherein said power control semiconductor device and said high-voltage transformer are disposed in proximity to said air feeding device in the cooling air flow, said power control semiconductor device being positioned first, before said high-voltage transformer, in the direction of rotation of said propeller;
• wherein said first and second frames are connected together at a connecting portion and fixed in an approximate L shape, and wherein said first and second guide walls define an airflow path for the cooling air flow for cooling said high frequency power supply;
• and
• at least one communicating hole in said first frame in proximity to said connecting portion for generating an air flow circulating therethrough for cooling parts of said high frequency power supply disposed in proximity to said connecting portion;
• and
• wherein said first guide wall comprises an extension of said casing member of said first frame, and has a height approximately equal to the level of said power control semiconductor device and said high-voltage transformer, said first guide wall having a top portion in proximity to a cooling path of said magnetron, and wherein said second guide wall is in proximity to said first guide wall so as to surround said power control semiconductor device and said high-voltage transformer.