Wet-etchable random polyimide copolymer for multichip module applications
AssigneeE. I. Du Pont de Nemours and Company
InventorJohn D. Summers
Life of this patent
Estimating the term…
Abstract
A random polyimide copolymer, based on a rigid dianhydride, a rigid diamine and an additional diamine and/or dianhydride containing one or more flexibilizing linkages. Soft-baked coatings of the poly(amic acid) precursor are readily processed using conventional aqueous base developers, such as tetramethylammonium hydroxide. The polyimide and soft-baked coatings are useful as a dielectric layer In multichip module applications or as a stress buffer coating.
Claims3
A random poly(amic acid) copolymer or partially cured poly(amic acid) copolymer consisting essentially of from 20 to 50 mole % of a rigid aromatic 3,3', 4,4'-biphenyltetracarboxylic dianhydride component, from 5 to 50 mole % of a rigid p-phenylene diamine component, and from 12 to 45 mole %, based on the total molar amounts or aromatic dianhydride and diamine components, of a flexible aromatic 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride component, wherein said poly(amic acid) or partially cured poly(amic acid) has a wet-etch rate of from 0.3 to 1.0 micron per second in 0.26 N aqueous tetramethylammonium hydroxide solution.
Dependencies are inferred from the claim text.