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US 5,393,815 AGranted
Silazane-based, heat resistant, dielectric coating compositions
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYoshihumi Takeda, Toshinobu Ishihara, Hiromi Ohsaki
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Abstract
By blending a silazane with an organic silicon polymer such as polycarbosilane and polysilazane and inorganic powder such as alumina and silica, there is obtained a coating composition which can be applied and baked onto metallic and non-metallic substrates to form dielectric coatings which are improved in many properties including substrate adhesion, hardness, electrical insulation, heat resistance, water resistance, and chemical resistance.
Claims3
A coating composition capable of forming a dielectric coating having improved adhesion and heat resistance comprising:
- an organic silicon polymer selected from the group consisting of polycarbosilanes having a number average molecular weight of about 600 to 2,000 and polysilazanes having a number average molecular weight of about 500 to about 2,000,
- a silazane compound selected from the group consisting of tetramethyldisilazane, hexamethylcyclotrisilazane, octamethylcyclo tetrasilazane and mixtures thereof, and
- an inorganic powder having a mean particle size of from about 0.1 to about 30.mu.m,
- said composition comprising, based on the total weight of the composition, about 5 to about 50% by weight of the organic silicon polymer about 5 to about 40% by weight of the silazane compound, and about 10 to about 70% by weight of the inorganic powder.
1 more element
Dependencies are inferred from the claim text.