Method for forming multilayer indium bump contacts

A method for fabricating an array of high density, multilayer electrical contacts for interfacing an array of infrared detectors and signal processing modules, the method comprising the steps of:

• a) forming a first conductive layer upon a substrate;
• b) forming a second conductive layer upon the first conductive layer, said second conductive layer being comprised of indium;
• c) mounting the substrate upon a programmable X-Y table;
• and
• d) using a microprocessor controlled laser to scribe the substrate by moving the X-Y table according to a program to selectively remove corresponding portions of said first and second conductive layers such that an array of islands is substantially simultaneously formed upon the substrate, each island being comprised of said first and second conductive layers and defining a bump contact, each contact being separately connectable to a dedicated infrared detector and to a signal processing module.