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US 5,393,641 AGranted
Radiation-sensitive resin composition
AssigneeOki Electric Industry Co., Ltd.
InventorsToshio Ito, Miwa Sakata
Life of this patent
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Abstract
A novel radiation-sensitive resin composition having high sensitivity and high O.sub.2 -RIE resistance is otained by blending 0.5 g of poly(di-t-butoxysiloxane), 50 mg of triphenylsulfonium trifluoromethanesulfonate as acid-producing agent, and 4 ml of 2-methoxyethyl acetate as solvent.
Claims6
A radiation-sensitive resin composition comprising:
- a linear polysiloxane having a C--O--Si bond in each monomer unit, wherein said polysiloxane is a poly(dialkoxysiloxane) or a poly(diaryloxysiloxane) represented by the following formula (1):
- ##STR5## where R.sup.1 and R.sup.2 are primary, secondary or tertiary alkyl groups or aryl groups which are identical to or different from one another, R.sup.3 is hydrogen or trimethylsilyl, and n represents degree of polymerization;
- and
- an acid-producing agent which decomposes to produce acid due to the action of radiation.
1 more element
Dependencies are inferred from the claim text.