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US 5,393,489 AGranted
High temperature, lead-free, tin based solder composition
AssigneeInternational Business Machines Corporation
InventorsStephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
Life of this patent
Estimating the term…
Abstract
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.
Claims1
A high solidus temperature, high service temperature, high strength multi-component solder alloy consisting of 93.5 to 94.0 weight % Sn, 2.5 to 3.0 weight % Ag, 1.0 to 2.0 weight percent Bi, 1.0 to 2.0 weight percent Sb, and 1.0 weight percent Cu.
Dependencies are inferred from the claim text.