Semiconductor wafer processing apparatus
AssigneeTokyo Electron Sagami Limited
InventorWataru Ohkase
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Abstract
The present invention relates to semiconductor wafers which have a through hole formed at their center portion. A processing apparatus provided with a conveyor means including a wafer holder having a holding protrusion which engages with this through hole implements oxidation and dispersion processing or CVD processing to a processing surface of a semiconductor wafer so that a semiconductor wafer can have heat treatment performed without accompanying film growth faults or heat distortion.
Claims7
A processing apparatus for movement of a semiconductor wafer which has a through hole at a center portion thereof, said apparatus comprising:
- a wafer movement fork;
- a shaft;
- and
- a wafer holder centrally mounted on said shaft for receiving semiconductor wafers from said wafer movement fork, said shaft partially protruding through said wafer holder, said wafer holder having a circumferential portion including at least three support protrusions thereon, whereby a semiconductor wafer received from said fork is mounted on said wafer holder and maintained in a horizontal position by inserting said shaft into the through hole of the received wafer until said support protrusions abut an under-surface of the wafer.
Dependencies are inferred from the claim text.