Capacitance type accelerometer

A method manufacturing capacitance type accelerometers comprising the steps of:

• forming a plurality of first silicon plates on a wafer, each of the first silicon plates having a movable electrode part which is moved according to acceleration;
• respectively forming a plurality of two second silicon plates on respective other wafers, respective one of the two second silicon plates being disposed on both sides of the first silicon plate with a certain separation distance;
• respectively disposing thermal oxide films having low fusion point glasses respectively between the first silicon plates except the movable electrode parts and the two second silicon plates;
• and
• respectively sticking the first silicon plates except the movable electrode part on the wafer and the two second silicon plates together by heat treatment of the first and second silicon plates on the other wafers;
• and
• dicing the wafer and the other wafers so as to form the respective accelerometers.

A method manufacturing capacitance type accelerometers, comprising the steps of:

• forming a plurality of first silicon plates on a wafer, each of the first silicon plates having a movable electrode part which is moved according to acceleration;
• respectively forming two second silicon plates on respective other wafers, respective ones of the two second silicon plates being disposed on both sides of the first silicon plate with a certain separation distance;
• respectively disposing thermal oxide films between the first silicon plate except the movable electrode part and the two second silicon plates and respectively sticking the first silicon plate except the movable electrode part on the wafer and the two second silicon plates together by bonding heat treatment of the first and second silicon plates on the other wafers;
• and
• dicing the wafer and the other wafers so as to form the respective accelerometers.

A capacitance type accelerometer, comprising:

• a first silicon plate formed so as to provide a movable electrode part which is moved according to acceleration;
• two fixed second plates which are disposed on both sides of the first silicon plate with certain separation distances;
• a first conductive member which is electrically connected to the movable electrode part and is disposed at a side of the first silicon plate;
• and
• two second conductive members which are respectively electrically connected to the second fixed plates and are respectively disposed at sides of the second fixed plates wherein the separation distances are precisely obtained by sticking the plates together by the heat processing of thermal oxide films formed upon the plates.