Compositions and methods for polishing
AssigneeRodel, Inc.
InventorsGregory Brancaleoni, Lee M. Cook
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Abstract
Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.
Claims16
A method of polishing a composite, one component of which is silicon, silica or silicates in which a polishing composition comprising:
- an aqueous medium, abrasive particles, an oxidizing agent and a compound or compounds which suppress the rate of removal of silica wherein each of said compound or compounds contains at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH Of the polishing composition is used as the polishing slurry.
A method according to claims 1, 2, 5, 6 or 3 wherein an additional component of said composite is tungsten metal.
A method for polishing an integrated circuit whose surface is comprised of metal and silica in which a polishing composition comprising:
- an aqueous medium, abrasive particles, an oxidizing agent and a compound or compounds which suppress the rate of removal of silica, wherein each of said compound or compounds contains at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition is used as the polishing slurry.
Dependencies are inferred from the claim text.