Surface modification by accelerated plasma or ions

A process for modifying a polymeric surface comprising projecting either pulses or a scanned beam of ions or plasma having a molecular weight of at least one against a polymeric surface at a fluence of 10.sup.-3 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 Bar with an effective pulse duration of 10 nanoseconds to 1 millisecond, said projecting etching said polymeric surface or adding chemistry to said polymeric surface, wherein said pressure is less than 0.05 Bar.

A process for modifying a polymeric surface comprising projecting either pulses or a scanned beam of ions or plasma having a molecular weight of at least 1 against a polymeric surface at a fluence of 10.sup.-3 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 bar with an effective pulse duration of 10 nanoseconds to 1 millisecond, wherein after projecting pulses of ions or plasma against said polymeric surface a metal layer is deposited onto said polymeric surface and wherein said metal layer is removed from said polymeric surface at least in some areas upon which pulses of ions or plasma have not been projected.

A process for modifying a surface selected from the group consisting essentially of organic polymers, glasses, ceramics, and metals, said process comprising projecting ions or plasma having a molecular weight of at least 1 as 1 to 20 effective pulses or beams against said surface at a fluence of 1 mJ/cm.sup.2 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 Bar with an effective pulse duration of 10 nanoseconds to 1 millisecond.

A process for modifying a surface, said process comprising projecting ions or plasma as 1 to 20 effective pulses or beams against said surface at a fluence of 1 mJ/cm.sup.2 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 Bar with an effective pulse duration of 10 nanoseconds to 1 millisecond, wherein said surface comprises a glass and said glass is etched or ablated by said ions or plasma.

A process for modifying a surface, said process comprising projecting ions or plasma as 1 to 20 effective pulses or beams against said surface at a fluence of 1 mJ/cm.sup.2 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 Bar with an effective pulse duration of 10 nanoseconds to 1 milliseconds, wherein said surface comprises a ceramic and said ceramic is etched or ablated by said ions or plasma.

A process for modifying a metal, said process comprising projecting ions or plasma having a molecular weight of at least 1 as 1 to 20 effective pulses or beams against said surface at a fluence of 1mJ/cm.sup.2 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 Bar with an effective pulse duration of 10 nanoseconds to 1 millisecond, wherein said surface of said metal is etched or ablated by said ions or plasma and wherein said metal comprises a metal layer of 1 to 500 nm on a polymer.

A process for modifying a polymeric surface comprising projecting either pulses or a scanned beam of ions or plasma having a molecular weight of at least 1 against a polymeric surface at a fluence of 10.sup.-3 to 10.sup.3 J/cm.sup.2 at a pressure less than 0.8 Bar with an effective pulse duration of 10 nanoseconds to 1 millisecond, said projecting etching said polymeric surface or adding chemistry to said polymeric surface, wherein a coating is present on said polymer surface during said treatment and the adhesion of said coating to said polymer surface is increased by said treatment.