High dielectric constant coatings
AssigneeDow Corning Corporation
InventorsLoren A. Haluska, Keith W. Michael
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Abstract
Disclosed is a method of forming high dielectric constant coatings on substrates. The method comprises applying a coating of hydrogen silsesquioxane resin and a high dielectric constant filler onto a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a silica containing ceramic matrix containing the filler.
Claims17
A method of forming a coating with a dielectric constant of at least 8 on a substrate comprising:
- applying a coating composition comprising hydrogen silsesquioxane resin and about 5 to about 90 weight percent of a filler having a dielectric constant of at least 8 onto a substrate;
- and
- heating the coated substrate at a temperature sufficient to convert the coating composition into a ceramic coating having a dielectric constant of at least 8.
A coating composition comprising hydrogen silsesquioxane resin and about 5 to about 90 weight percent of a filler having a dielectric constant of at least 8 diluted in a solvent.
Dependencies are inferred from the claim text.