Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape

Semiconductor carrier assembly, comprising;

• a flexible substrate having first and second portions, each of said first and second portions having a top surface with a plurality of electrically isolated solderable metalized areas thereon and a bottom surface, said flexible substrate having electrical interconnection paths connecting at least some of said plurality of metalized areas on said top surface of said first portion to at least some of said plurality of metalized areas on said top surface of said second portion;
• at least one semiconductor device mounted to said first portion top surface and soldered to said at least some of said solderable areas on said first portion top surface;
• at least one rigidizer plate, said bottom surface of said first portion of said flexible substrate mounted to said first rigidizer plate and said second portion of said flexible substrate mounted such that said bottom surface of said second portion of said flexible substrate faces and is spaced apart from said bottom surface of said first portion of said flexible substrate such that said flexible substrate has a generally U-shaped configuration disposed about said rigidizer plate with said rigidizer plate positioned in the notch of said U;
• and
• a circuit board having solderable areas on a surface thereof which is mounted to said second portion top surface, wherein solder connections bond and electrically connect said solderable areas on the top surface of said circuit board to some of said solderable areas on the second portion top surface of said flexible circuit.

Semiconductor carrier assembly, comprising;

• a flexible substrate having first and second portions, each of said first and second portions having a top surface with a plurality of electrically isolated metalized areas thereon and a bottom surface, said flexible substrate having electrical interconnection paths connecting at least some of said plurality of metalized areas on said top surface of said first portion to at least some of said plurality of metalized areas on said top surface of said second portion;
• at least one semiconductor device mounted to said first portion top surface and electrically connected to said at least some of said metalized areas on said first portion top surface;
• at least one rigidizer plate, said bottom surface of said first portion of said flexible substrate mounted to said first rigidizer plate and said second portion of said flexible substrate mounted such that said bottom surface of said second portion of said flexible substrate faces and is spaced apart from said bottom surface of said first portion of said flexible substrate such that said flexible substrate has a generally U-shaped configuration disposed about said rigidizer plate with said rigidizer plate positioned in the notch of said U;
• and
• at least a second rigidizer plate, each of the first and second rigidizer plates having a temperature coefficient of expansion (TCE) with the temperature coefficient of expansion of each of the rigidizer plates being substantially different from one another, and wherein said bottom surface of said second portion of said flexible substrate is mounted to said second rigidizer plate.

Semiconductor carrier assembly, comprising;

• a flexible substrate having first and second portions, each of said first and second portions having a top surface with a plurality of electrically isolated solderable metalized areas thereon and a bottom surface, said flexible substrate having electrical interconnection paths connecting at least some of said plurality of metalized areas on said top surface of said first portion to at least some of said plurality of metalized areas on said top surface of said second portion;
• at least one semiconductor device mounted to said first portion top surface and soldered to said at least some of said solderable areas on said first portion top surface;
• at least one rigidizer plate, said bottom surface of said first portion of said flexible substrate mounted to said first rigidizer plate and said second portion of said flexible substrate mounted such that said bottom surface of said second portion of said flexible substrate faces and is spaced apart from said bottom surface of said first portion of said flexible substrate such that said flexible substrate has a generally U-shaped configuration disposed about said rigidizer plate with said rigidizer plate positioned in the notch of said U;
• and
• at least a second rigidizer plate, each of the first and second rigidizer plates having a temperature coefficient of expansion (TCE) with the temperature coefficient of expansion of each of the rigidizer plates being substantially different from one another, and wherein said bottom surface of said second portion of said flexible substrate is mounted to said second rigidizer plate.