Compositions containing hollow microspheres
AssigneeOatey Co.
InventorPaul E. Naton
Life of this patent
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Abstract
A composition is described with comprises a mixture of (A) from about 5% to about 60% by weight of at least one water-insoluble polymer; (B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and (C) from about 20% to about 85% of at least one volatile organic liquid which is a solvent for the polymer of (A). The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low VOC compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
Claims31
A composition comprising a mixture of
- (A) from about 5% to about 60% by weight of at least one water-insoluble polymer selected from acrylonitrile-butadiene-styrene polymer, polyvinyl chloride, chlorinated polyvinyl chloride or mixtures thereof;
- (B) from about 1% to about 30% by weight of glass or synthetic resinous hollow microspheres;
- (C) from about 10% to about 85% by weight of at least one volatile organic liquid which is a solvent for the polymer of (A);
- and
- (D) from about 0.1% to about 5% by weight of at least one solid particulate inorganic filler.
An adhesive composition comprising a mixture of
- (A) from about 5% to about 60% by weight of at least one acrylonitrile-butadiene-styrene polymer;
- (B) from about 1% to about 30% by weight of glass or synthetic resinous hollow microspheres;
- and
- (C) from about 10% to about 85% by weight of at least one volatile organic liquid which is a solvent for the polymer of (A).
An adhesive composition comprising a mixture of
- (A) from about 10% to about 60% by weight of at least one acrylonitrile-butadiene-styrene polymer;
- (B) from about 1% to about 20% by weight of inorganic or synthetic resinous hollow microspheres;
- and
- (C) from about 20% to about 85% of at least one volatile organic liquid which is a solvent for the polymer of (A).
An adhesive composition for forming a bond or weld between two acrylonitrile-butadiene-styrene polymer or polyvinyl chloride surfaces comprising a mixture of
- (A) from about 30% to about 50% by weight of an acrylonitrile-butadiene-styrene resin;
- (B) from about 3% to about 10% by weight of hollow glass microspheres having an average particle density of from about 0.1 to about 0.4 g/cc;
- (C) from about 50% to about 60% by weight of acetone or methyl ethyl ketone or mixtures thereof;
- and
- (D) from about 0.75% to about 1.5% by weight of at least one solid particulate inorganic filler having an average particle size of less than about 50 microns.
A method of adhesively bonding or welding a first plastic surface to a second plastic surface which comprises the steps of
- (I) applying a composition comprising a mixture of
- (A) from about 5% to about 60% by weight of at least one water-insoluble polymer;
- (B) from about 1% to about 30% by weight of glass or synthetic resinous hollow microspheres;
- and
- (C) from about 10% to about 85% by weight of at least one volatile organic liquid which is a solvent for the polymer of (A) to the first surface or the second surface, or both surfaces;
- (II) contacting the first surface with the second surface;
- and
- (III) allowing the adhesive composition to form a bond or weld between the first surface and the second surface.
A method of adhesively bonding or welding a first plastic surface to a second plastic surface which comprises the steps of
- (I) applying a composition comprising a mixture of
- (A) from about 10% to about 60% by weight of at least one water-insoluble polymer selected from acrylonitrile-butadiene-styrene polymer, polyvinyl chloride, chlorinated polyvinyl chloride or mixtures thereof;
- (B) from about 1% to about 20% by weight of glass or synthetic resinous hollow microspheres;
- and
- (C) from about 20% to about 70% by weight of at least one volatile organic liquid which is a solvent for the polymer of (A) to the first surface or the second surface, or both surfaces;
- (II) contacting the first surface with the second surface;
- and
- (III) allowing the adhesive composition to form a bond or weld between the first surface and the second surface.
Dependencies are inferred from the claim text.