Integrated circuit package with direct access to internal signals
AssigneeAptix Corporation
InventorsAndrew Switky, Robert Osann, Jr.
Life of this patent
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AssigneeAptix Corporation
InventorsAndrew Switky, Robert Osann, Jr.
Estimating the term…
A package for one or more integrated circuit dice which includes a spreader which provides a conventional signal path between the die and a printed circuit board to which it is demountably attached as well as an additional, more readily accessible subset of signals, preferably available through a flexible cable extending horizontally from the package. The spreader provides a first set of contacts on a first side for interface to the integrated circuit dice, a second set of contacts on a second side opposite the first side which are connected to some of the contacts of the first set of contacts for connection to the printed circuit board, and a third set of contacts on the first side along one edge thereof for engaging the flexible cable and carrying the subset of signals.
A reusable, self-contained integrated circuit die package for demountable attachment to a circuit board comprising:
A reusable, self-contained package for demountable attachment to a circuit board for housing at least one integrated circuit die having a plurality of input/output pins comprising:
A reusable, self-contained package for at least one integrated circuit die having a plurality of pins, said package comprising:
A circuit board and component assembly comprising:
A reusable, self-contained integrated circuit die package for demountable attachment to a circuit board comprising:
Dependencies are inferred from the claim text.