Method of cutting out a portion of a weak sheet
AssigneeMurata Manufacturing Co., Ltd.
InventorToshihiko Kogame
Life of this patent
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Abstract
A ceramic green sheet for making a laminated ceramic capacitor is formed on an upper surface of a carrier film and carried onto a surface plate while maintaining adhesion between the carrier film and the ceramic green sheet. Thereafter a cutting line having a closed outline is defined in the ceramic green sheet, and a cut sheet enclosed by the cutting line is removed from the green sheet by a pickup apparatus having a punching edge at its periphery and provided with a suction head at a portion of the pickup apparatus enclosed by the punching edge.
Claims20
A method of cutting out a cut sheet having predetermined dimensions from a weak sheet, said method comprising the steps of:
- forming a release layer of a mold release agent on a carrier film;
- forming a weak sheet on the release layer ;
- moving said weak sheet onto a base surface plate with said carrier film interposed between said weak sheet and said base surface plate;
- applying a punching edge to said weak sheet to punch through said weak sheet and said release layer and to at least reach said carrier film, thereby defining a continuous cutting line to form a cut sheet and a remaining part in said weak sheet wherein said carrier film is incompletely cut punching edge as it punches through said weak sheet and
- removing said cut sheet from the remaining part of said weak sheet and said carrier film by suction, while applying a stronger suction force to a peripheral portion of said cut sheet than to a central portion of said cut sheet.
A method of cutting out a cut sheet having predetermined dimensions from a weak sheet, said method comprising the steps of:
- forming a release layer of a mold release agent on a carrier film;
- forming a weak sheet on the release layer;
- moving said weak sheet onto a base surface plate with said carrier film interposed between said weak sheet and said base surface plate;
- applying a punching edge to said weak sheet to punch through said weak sheet and said release layer and to at least reach said carrier film, thereby defining a continuous cutting line to form a cut sheet and a remaining part in said weak sheet wherein said carrier film is incompletely cut by said punching edge as it punches through said weak sheet;
- removing said cut sheet from the remaining part of said weak sheet and said carrier film by suction from a suction head;
- having said punching edge disposed at its periphery which encloses said suction head ;
- and
- applying a stronger suction force to a peripheral portion of said cut sheet than to a central portion, by providing larger suction holes in a peripheral portion of a perforated surface of said suction head, than in a central portion thereof.
A method of cutting out a cut sheet having predetermined dimensions from a weak sheen, said method comprising the steps of:
- forming a release layer of a mold release agent on a carrier film;
- forming a weak sheet on the release layer;
- applying a punching edge to punch through said weak sheet and said release layer and form a continuous cutting line in said weak sheet, thereby defining a cut sheet and a remaining part;
- wherein said carrier film is incompletely cut by said punching edge as it punches through said weak sheet and
- applying a first suction force to a peripheral portion of said cut sheet and applying a second suction force which is substantially weaker than said first suction force to a central portion of said cut sheet, thereby removing the cut sheet from the carrier film and from the remaining part of said weak sheet by suction.
Dependencies are inferred from the claim text.