Method of stripping resists from substrates using hydroxylamine and alkanolamine
AssigneeEKC Technology, Inc.
InventorWai M. Lee
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Abstract
A stripping composition for removing resists from substrates containing hydroxylamine and at least one alkanolamine is described. Optionally, one or more polar solvents can also be included in the stripping composition. The stripping composition is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.
Claims14
A method of removing a resist from a substrate comprising contacting a substrate having a resist coating present thereon with a composition consisting essentially of hydroxylamine and at least one alkanolamine which is miscible with said hydroxylamine in an amount sufficient and at a temperature and for a time sufficient to remove said resist from said substrate.
Dependencies are inferred from the claim text.