Binder system for use in the injection molding of sinterable powders and molding compound containing the binder system

An injection moldable binder system for a sinterable powder that comprises:

• (a) 3-80 wt % of an olefinic polymer and/or copolymer with a molecular weight in excess of 2000 that has at least one epoxy group in the molecule;
• and
• (b) up to 70 wt % of a polymer and/or copolymer other than component (a) that has a molecular weight in excess of 2000;
• and
• (c) 20-80 wt % of an organic compound with a molecular weight of not more than 2000.

A binder system for use in injection molding of a sinterable powder comprising:

• (a) 3-80 wt % of an olefinic polymer and/or copolymer with a molecular weight in excess of 2000 that has at least one epoxy group in the molecule;
• and
• (b) up to 70 wt % of a polymer and/or copolymer other than component (a) that has a molecular weight in excess off 2000;
• and
• (c) 20-80 wt % of an organic compound with a molecular weight of not more than 2000, wherein said component (b) is a homopolymer and/or a copolymer that are prepared by (co)polymerizing one or more monomers selected from the group consisting of acrylate esters, methacrylate esters and styrene.

An injection moldable binder system for a sinterable powder that comprises:

• (a) 3-80 wt % of an olefinic polymer and/or copolymer with a molecular weight in excess of 2000 that has at least one epoxy group in the molecule;
• and
• (b) 10-60 wt % of a polymer and/or copolymer other than component (a) that has a molecular weight in excess of 2000;
• and
• (c) 20-80 wt % of an organic compound with a molecular weight of not more than 2000.

An injection moldable compound of a sinterable powder comprising a binder system which includes at least:

• (a) 3-80 wt % of an olefinic polymer and/or copolymer with a molecular weight in excess of 2000 that has at least one epoxy group in the molecule;
• and
• (b) up to 70 wt % of a polymer and/or copolymer other than component (a) that has a molecular weight in excess of 2000;
• and
• (c) 20-80 wt % of an organic compound with a molecular weight of not more than 2000 and 1) a metal powder, 2) a ceramic power or 3) a cermet powder.