Method for making cooling structures for directly cooling an active layer of a semiconductor chip

A process for providing a cooling structure for directly cooling an active layer of a semiconductor chip comprising the steps of:

• (a) forming a current/voltage supply level over at least a portion of said active layer of said semiconductor chip,
• (b) forming an insulator layer over at least a portion of said current/voltage supply level,
• (c) forming a heat transfer structure over at least a portion of said insulator layer and any exposed portions of said current/voltage supply level,
• (d) forming a thermal contact area on at least a portion of said heat transfer structure, and
• (e) forming a thermal bridge between said thermal contact area and a heat sink, such that heat is directly transferred from said active layer to said heat sink, thereby providing said direct cooling of said active layer of said semiconductor chip.