Micromechanical moving structures including multiple contact switching system
AssigneeGeneral Electric Company
InventorsMario Ghezzo, Richard J. Saia, Bharat S. Bagepalli, Imdad Imam, Dennis L. Polla
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AssigneeGeneral Electric Company
InventorsMario Ghezzo, Richard J. Saia, Bharat S. Bagepalli, Imdad Imam, Dennis L. Polla
Estimating the term…
Micromachining methods for fabricating micromechanical structures which include plunger elements free to reciprocate within cavities are fabricated using processing steps in common with those employed in high density interconnect (HDI) technology for multi-chip module packaging. A polymer, such as a polyimide, is utilized as a micromachinable material. In one embodiment, cavities are formed in the polymer material by laser ablation, employing a sacrificial layer as a mask. Electroplated copper may be employed as a sacrificial release layer. One particular structure is a micromechanical electric switch including an array of individual switch contacts actuatable in common.
A micromechanical structure comprising:
A micromechanical electric switch comprising:
A micromechanical electric switch comprising:
Dependencies are inferred from the claim text.