US 5,371,390 A · Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits

Abstract

An interconnect structure contains a substrate, a layer of separate conductive leads extending over the substrate in one direction, and another layer of separate conductive leads extending over the substrate in another, substantially different, direction. At least one conductive lead in each of the layers of conductive leads is divided into at least two electrically separate conductive segments. A plurality of cells are formed in the substrate. Each cell has a number of bonding pads formed above the substrate region where the cell is situated for allowing integrated circuit chips and/or electronic components to be connected to the cells. Programmable elements, typically programmed by devices in the substrate, enable connections to be formed between selected ones of the conductive leads or segments, thus enabling the integrated circuit chips and electronic components to be electrically interconnected. Devices formed in the substrate typically allow testing of the various components connected to the substrate to determine their performance and to check the integrity of the connections formed between the conductive leads or segments.

Claims25

Dependent claims

Structure comprising:

a substrate;
a first layer of separate conductive leads formed over said substrate in a first direction;
a second layer of separate conductive leads formed over said substrate in a second direction substantially different from said first direction, at least one conductive lead in each of said layers of conductive leads being divided into at least two electrically separate conductive segments at least one conductive lead or segment in each of said layers passing in an undivided manner by at least two conductive leads or segments in the other of said layers;
a number of electrically programmable elements for connecting selected conductive leads or segments to other conductive leads or segments or for disconnecting non-selected conductive leads or segments from other conductive leads or segments;
and
a plurality of cells formed in said substrate, each cell having a number of bonding pads formed over said substrate above the region of said substrate in which said cell is formed thereby to allow a plurality of integrated circuit chips and/or electronic components to be attached to and electrically connected to said plurality of cells.

3 more elements

Structure comprising:

a substrate;
a first layer of separate conductive leads formed over said substrate in a first direction;
a second layer of separate conductive leads formed over said substrate in a second direction substantially different from said first direction, at least one conductive lead in each of said layers of conductive leads being divided into at least two electrically separate conductive segments at least one conductive lead or segment in each of said layers passing in an undivided manner by at least two conductive leads or segments in the other of said layers;
a number of electrically programmable elements for connecting selected conductive leads or segments to other conductive leads or segments or for disconnection non-selected conductive leads or segments from other conductive leads or segments;
a plurality of cells formed in said substrate, each cell having a number of bonding pads formed over said substance above the region of said substrate in which said cell is formed thereby to allow a plurality of integrated circuit chips and/or electronic components to be attached to and electrically connected to said plurality of cells;
and
a plurality of devices formed in said substrate for programming all or a portion of said electrically programmable elements.

4 more elements

Structure comprising:

a substrate;
first layer of separate conductive leads formed over said substrate in a first direction;
a second layer of separate conductive leads formed over said substrate in a second direction substantially different from said first direction, at least one conductive lead in each of said layers of conductive leads being divided into at least two electrically separate conductive segments at least one conductive lead or segment in each of said layers passing in an undivided manner by at least two conductive leads or segments in the other of said layers;
a plurality of cells formed in said substrate, each cell having a number of bonding pads formed over said substrate above the region of said substrate in which said cell is formed thereby to allow a plurality of integrated circuit chips and/or electronic components to be attached to and electrically connected to said plurality of cells;
and
a plurality of devices formed in said substrate for testing said conductive leads and segments and/or said plurality of integrated circuit chips and/or electronic components to be attached to and electrically connected to said plurality of cells.

3 more elements

Dependencies are inferred from the claim text.

Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits

Life of this patent

Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits

Life of this patent

Abstract

Claims25