Chip type directional coupler comprising a laminated structure

A chip type directional coupler comprising:

• a laminated structure including a plurality of dielectric substrates, each dielectric substrate having a pair of stripline electrodes nonlinearly disposed in parallel with each other on one major surface thereof, and a plurality of ground electrode substrates, each ground electrode substrate being provided with a ground electrode on one major surface thereof, each ground electrode having two ends, said dielectric substrates and said ground electrode substrates being alternately stacked so that uppermost and lowermost layers are defined by respective ones of said ground electrode substrates;
• and
• said laminated structure having side surfaces, and a plurality of external electrodes disposed on said side surfaces of said laminated structure,
• said pairs of stripline electrodes disposed on respective said dielectric substrates being connected in series with each other through said ground electrode substrates interposed therebetween to define a pair of stripline electrodes each having a predetermined overall electrical length and each having two ends, both ends of said stripline electrodes and said ground electrodes respectively being electrically connected to different ones of said external electrodes.