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AssigneeConductus, Inc.
InventorsKookrin Char, Stephen M. Garrison, Nathan Newman, Gregory G. Zaharchuk
Estimating the term…
A novel method of producing weak-link grain boundary Josephson junctions in high temperature superconducting thin films is disclosed. These junctions are reliably and reproducibly formed on uniform planar substrates (10) by the action of a seed layer (40) placed intermediate the substrate (10) and the superconductor film (20). The superconductor film (22) grown atop the seed (42) is misoriented from the rest of the film (24) by an angle between 5.degree. and 90.degree.. The grain boundary (30) so formed acts as a high quality weak-link junction for superconductor devices. The performance of these junctions can be improved by the addition of buffer layers (50, 60) between the substrate (10) and the superconductor film (20).
A method of fabricating a weak-link junction on a planar surface of a uniform substrate having a first region and a second region adjacent said first region and a border between said first region and said second region comprising:
The method of Clam 1 wherein said first deposition step comprises depositing at least one buffer layer in said first region only and then depositing at least one seed layer in said first region only and then depositing at least one buffer layer in said first region and in said second region.
Dependencies are inferred from the claim text.